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Valens Teams With Intel, Teledyne, and Others to Power Next-Gen Machine Vision Solutions, To Showcase AI-Driven Connectivity Tech at Embedded World 2025

Benzinga·03/10/2025 07:46:37
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Valens Semiconductor (NYSE:VLN), a leader in high-performance connectivity, today announced that it will display its innovative connectivity technology required for various AI applications at Embedded World 2025. Valens will display demonstrations in collaboration with a variety of companies, all offering the machine vision market cutting-edge solutions based on Valens' standard-compliant chipsets. These companies include Leopard Imaging, Acroname, Airy3D, Cherry Embedded Solutions, D3 Embedded, Fabrimex, Framos, Intel, RGo Robotics, and Teledyne e2v.